JPS6345743Y2 - - Google Patents
Info
- Publication number
- JPS6345743Y2 JPS6345743Y2 JP6257383U JP6257383U JPS6345743Y2 JP S6345743 Y2 JPS6345743 Y2 JP S6345743Y2 JP 6257383 U JP6257383 U JP 6257383U JP 6257383 U JP6257383 U JP 6257383U JP S6345743 Y2 JPS6345743 Y2 JP S6345743Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- ground wire
- metal rod
- shrinkable sleeve
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 23
- 239000011247 coating layer Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 238000000605 extraction Methods 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- HDERJYVLTPVNRI-UHFFFAOYSA-N ethene;ethenyl acetate Chemical compound C=C.CC(=O)OC=C HDERJYVLTPVNRI-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Insulating Bodies (AREA)
- Cable Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6257383U JPS59168968U (ja) | 1983-04-26 | 1983-04-26 | プラスチツク外被ケ−ブル接続部のア−ス線取り出し構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6257383U JPS59168968U (ja) | 1983-04-26 | 1983-04-26 | プラスチツク外被ケ−ブル接続部のア−ス線取り出し構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59168968U JPS59168968U (ja) | 1984-11-12 |
| JPS6345743Y2 true JPS6345743Y2 (en]) | 1988-11-28 |
Family
ID=30192763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6257383U Granted JPS59168968U (ja) | 1983-04-26 | 1983-04-26 | プラスチツク外被ケ−ブル接続部のア−ス線取り出し構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59168968U (en]) |
-
1983
- 1983-04-26 JP JP6257383U patent/JPS59168968U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59168968U (ja) | 1984-11-12 |
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